The ACP (air cavity of plastic) is similar in shape to the cavity ceramic (ACC) shell, and a cavity is formed by gluing a plastic cover, a plastic wall, and a metal flange.

In the ACP package, the chip operates in the cavity, and the metal flange can effectively conduct heat.

Application: RF power amplifier, RF energy, optical communication, MEMS.

ACC（air cavity of ceramic）Lead frame, ceramic ring (partial metallization), metal flange are welded to form cavity by silver copper solder brazing.

The final cover with rubber cover can achieve quasi-air-tight protection.

Ceramic shell characteristics:

Low dielectric loss ensures high frequency performance

Withstand ultra-high temperature working environment

Achieving quasi-air tightness

Application: RF power amplifier, RF energy, optical communication, MEMS

High-efficiency one-piece injection molding cavity shell

Chip area CTE and chip matching

Product cost-effective

Reduce chip stress

Achieving quasi-air tightness

Application: MEMS devices, infrared devices, optical communication devices:

Pressure Sensor;

thermal Sensor;

Mechanical Sensor；

Infrared Sensor；

Optical Communication TOSA/ROSA.

Ceramic Substrate 99%/96%

Good thermal conductivity, high temperature resistance and mechanical strength.

Surface copper cladding can be performed by processes such as DBC/DPC.

Applications: Power Electronics, Consumer Electronics, LED Lighting.