Amplebay High Power Cooling
Multilayer Heat Sink Series
CPC (Cu-MoCu-Cu): The middle layer of the heat sink is MoCu, which can be multi-layered, generally 3 layers, with more Cu content and higher thermal conductivity.
CMC (Cu-Mo-Cu): the heat sink intermediate layer is Mo, the thermal expansion coefficient is low and stable.
Diamond Heat Sink Series
Diamond series products are composite materials of copper/silver and diamond, which have the characteristics of low resistance,
low thermal expansion coefficient and ultra-high thermal conductivity.
Microchannels Cooler, (MCC）
Original Low Expansion Coefficient MCC
Microchannels Cooler: copper/aluminum/ceramic liquid cooler, etc.
A liquid cooling radiator with a water flow channel diameter of less than 500μm, used for semiconductor laser chip packaging.
High processing accuracy, the flatness of the chip mounting area is <2μm, the roughness Ra<0.01μm, and the R corner radius of the key edge is <5μm.
Tel: +86-13702922211
Add:Unit 3, Southwest Side, 3rd Floor, Block D, No. 1, Xinming 2nd Road, Shiwan Town, Chancheng District, Foshan City, Guangdong Province,China 528000
Email: sales@amplebay.cn
